Card structure, socket structure, and assembly structure thereof

ABSTRACT

A card structure includes a first substrate, a second substrate, an intermediate unit, and a connector. The first substrate includes a base surface. The second substrate is disposed on the base surface of the first substrate and coupled to the first substrate. The connector is disposed on the base surface of the first substrate to juxtapose the second substrate via the intermediate unit and coupled to the first substrate.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a division of U.S. patent application Ser. No. 12/759,671 filed Apr. 13, 2010, claims the benefit of U.S. Provisional Application No. 61/187,856, filed on Jun. 17, 2009, the entirety of which is/are incorporated by reference herein. This application claims priority of Taiwan Patent Application No. 98136426, filed on Oct. 28, 2009, the entirety of which is incorporated by reference herein.

BACKGROUND OF THE DISCLOSURE

1. Field of the Disclosure

The present disclosure relates to a card structure, a socket structure and an assembly structure thereof, and in particular relates to a slim memory card structure, a socket structure and an assembly structure thereof for USB 3.0 specifications.

2. Description of the Related Art

For USB slim memory cards or USB plugs provided with electronic parts (not shown in FIGs.) therein (referred to U.S. Pat. No. 7,440,287), a chip on board (COB) device is provided with a number of electronic parts, chips and welding dots. When the COB and a connector are connected to each other by a welding process, heat flux generated during the welding process will reheat these electronic parts, chips and welding dots, and these electronic parts, chips and welding dots are possibly dislocated or damaged by thermal effect.

Furthermore, in the present market, most of card memory devices or products (e.g., micro SD, thin USB storage cards, etc.) are manufactured by methods such as semiconductor manufacturing processes. A flat metallic pad of these card memory devices or products can be produced by an integral formation method, but non-flat metallic pads are not.

BRIEF SUMMARY OF THE DISCLOSURE

The disclosure provides a card structure capable of eliminating the thermal effect affecting electrical components to be dislocated or damaged while welding, thus, to increase yield of products. Additionally, the disclosure provides different designs and manufacturing procedures to produce connectors and electrical circuits, respectively. Under associated protocols, these connectors and electrical circuits are coupled to each other by their contact points which are juxtaposed to each other, and these juxtaposed contact points are snugly welded or glued by an associated mechanism, thereby attaining the desired functions and reducing dimension of the products.

One embodiment of the disclosure provides a card structure, comprising a first element and a second element. The first element comprises a first peripheral portion and at least one first contact point exposed by the first peripheral portion. The second element comprises a second peripheral portion and at least one second contact point corresponding to the at least one first contact point of the first element and exposed by the second peripheral portion. When the first and second elements are joined with each other, the first peripheral portion of the first element and the second peripheral portion of the second element are adjacent to each other, such that the at least one first contact point of the first element and the at least one second contact point of the second element are juxtaposed to each other.

One embodiment of the disclosure provides an assembly structure, comprising a socket structure and a card structure. The socket structure comprises a socket body and a socket contact unit disposed on the socket body. The card structure is detachably disposed on the socket body of the socket structure. The card structure comprises a first element, a second element and a card contact unit. The first element comprises a first peripheral portion and at least one first contact point exposed by the first peripheral portion. The second element comprises a second peripheral portion and at least one second contact point corresponding to the at least one first contact point of the first element and exposed by the second peripheral portion, wherein the first peripheral portion of the first element and the second peripheral portion of the second element are adjacent to each other when the first and second elements are joined with each other, such that the at least one first contact point of the first element and the at least one second contact point of the second element are juxtaposed to each other. The card contact unit coupled to the at least one second contact point of the second element, detachably contacting the socket contact unit of the socket structure. When the card structure is disposed on the socket structure, the card contact unit of the card structure contacts the socket contact unit of the socket structures, such that the socket structure and the card structure are coupled to each other.

One embodiment of the disclosure provides a card structure for a socket structure provided with a plurality of first elastic plates and a plurality of second elastic plates. The card structure comprises a body, a plurality of first pad portions and a plurality of second pad portions. The body comprises an outer surface. The plurality of first and second pad portions disposed on the outer surface of the body correspond to the plurality of first and second elastic plates of the socket structure, respectively. When the card structure is disposed on the socket structure, the plurality of first and second pad portions of the card structure respectively contact the plurality of first and second elastic plates of the socket structure.

One embodiment of the disclosure provides a socket structure for a card structure provided with a plurality of first pad portions and a plurality of second pad portions. The socket structure comprises a body, a plurality of first contact portions, and a plurality of second contact portions. The body comprises a slot comprising a sidewall surface and an opening. The plurality of first and second contact portions disposed on the sidewall surface of the slot of the body correspond to the plurality of first and second pad portions of the card structure, respectively. When the card structure is disposed on the body of the socket structure though the opening of the slot of the body of the socket structure, the plurality of first and second pad portions of the card structure respectively contact the plurality of first and second contact portions of the socket structure.

One embodiment of the disclosure provides a card structure, comprising a first substrate, a second substrate and a connector. The first substrate comprises a base surface, at least one electronic part region disposed on the base surface, and a terminal region disposed on the base surface. The second substrate is disposed on the base surface of the first substrate and coupled to the terminal region of the first substrate. The connector, disposed on the base surface of the first substrate to juxtapose the second substrate, comprises a connecting surface, a contact unit, and a plurality of contact regions disposed on the connecting surface and coupled to the contact unit. When the connecting surface of the connector is connected to the base surface of the first substrate, the connector covers the at least one electronic part region of the first substrate and the plurality of contact regions of the connector are coupled to the terminal region of the first substrate, such that the plurality of contact regions of the connector are coupled to the second substrate via the terminal region of the first substrate.

One embodiment of the disclosure provides a card structure, comprising a first substrate, a second substrate, an intermediate unit and a connector. The first substrate comprises a base surface. The second substrate, disposed on the base surface of the first substrate, is coupled to the first substrate. The connector, disposed on the base surface of the first substrate to juxtapose the second substrate via the intermediate unit, is coupled to the first substrate.

One embodiment of the disclosure provides an assembly structure, comprising an outer shell structure and a card structure. The outer shell structure comprises a shell body comprising a first access portion and a second access portion connected to the first access portion. The card structure, detachably disposed on the shell body of the outer shell structure via the first access portion or the second access portion of the shell body of the outer shell structure, comprises a first element, a second element and a card contact unit. The first element comprises a first peripheral portion and at least one first contact point exposed by the first peripheral portion. The second element comprises a second peripheral portion and at least one second contact point corresponding to the at least one first contact point of the first element and exposed by the second peripheral portion. The card contact unit, disposed on the second element, is coupled to the at least one second contact point of the second element. When the card structure is disposed on the shell body of the outer shell structure via the first access portion or the second access portion of the shell body of the outer shell structure, a compartment is formed between the card structure and the shell body of the outer shell structure and the card contact unit of the card structure faces the compartment.

One embodiment of the disclosure provides an assembly structure, comprising an outer shell structure and a card structure. The outer shell structure comprises a shell body comprising a first access portion and a second access portion connected to the first access portion. The card structure, detachably disposed on the shell body of the outer shell structure via the first access portion or the second access portion of the shell body of the outer shell structure, comprises a body, a plurality of first pad portions and a plurality of second pad portions. The body comprises an outer surface. The plurality of first and second pad portions are disposed on the outer surface of the body. When the card structure is disposed on the shell body of the outer shell structure via the first access portion or the second access portion of the shell body of the outer shell structure, a compartment is formed between the card structure and the shell body of the outer shell structure and the plurality of first and second pad portions of the card structure faces the compartment.

A detailed description is given in the following embodiments with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:

FIG. 1A is an exploded view of a card structure of a first embodiment of the disclosure;

FIG. 1B is an assembled view of the card structure of FIG. 1A;

FIG. 1C is a schematic view of the card structure of FIG. 1B after welding;

FIG. 2 is a schematic view of a variation example according to the card structure of the first embodiment of the disclosure;

FIG. 3A is an exploded view of a card structure of a second embodiment of the disclosure;

FIG. 3B is an assembled view of the card structure of FIG. 3A;

FIG. 4 is a perspective view of a card structure of a third embodiment of the disclosure;

FIG. 5A is an exploded view of an assembly structure of a fourth embodiment of the disclosure;

FIG. 5B is an assembled view of the assembly structure of FIG. 5A;

FIG. 6A is an exploded view of a card structure of a fifth embodiment of the disclosure;

FIG. 6B is an assembled view of the card structure of FIG. 6A;

FIG. 7A is a side view of the card structure of FIG. 6B;

FIG. 7B is a top view of the card structure of FIG. 6B;

FIG. 8A is an exploded view of a card structure of a sixth embodiment of the disclosure;

FIG. 8B is an assembled view of the card structure of FIG. 8A;

FIG. 9A is a side view of the card structure of FIG. 8B;

FIG. 9B is a top view of the card structure of FIG. 8B;

FIG. 10A is a schematic view of a card structure of a seventh embodiment of the disclosure;

FIG. 10B is a top view of the card structure of FIG. 10A;

FIG. 11A is a schematic view of a card structure of an eighth embodiment of the disclosure;

FIG. 11B is a top view of the card structure of FIG. 11A;

FIG. 12A is a schematic view of a card structure of a ninth embodiment of the disclosure;

FIG. 12B is a top view of the card structure of FIG. 12A;

FIG. 13A is a schematic view of a first element of a card structure of a tenth embodiment of the disclosure;

FIG. 13B is a schematic view of a second element of the card structure of the tenth embodiment of the disclosure;

FIG. 13C is a schematic view of the assembled first and second elements of the card structure of the tenth embodiment of the disclosure;

FIG. 13D is a sectional view of the card structure along line (z1-z1) of FIG. 13C;

FIG. 13E is a schematic view of a variation example according to the card structure of the tenth embodiment of the disclosure;

FIG. 14A is a schematic view of a first element of a card structure of an eleventh embodiment of the disclosure;

FIG. 14B is a schematic view of a second element of the card structure of the eleventh embodiment of the disclosure;

FIG. 14C is a schematic view of the assembled first and second elements of the card structure of the eleventh embodiment of the disclosure;

FIG. 14D is a sectional view of the card structure along line (z2-z2) of FIG. 14C;

FIG. 14E is a schematic view of a variation example according to the card structure of the eleventh embodiment of the disclosure;

FIG. 15A is a schematic view of a first element of a card structure of a twelfth embodiment of the disclosure;

FIG. 15B is a schematic view of a second element of the card structure of the twelfth embodiment of the disclosure;

FIG. 15C is a schematic view of the assembled first and second elements of the card structure of the twelfth embodiment of the disclosure;

FIG. 15D is a sectional view of the card structure along line (z3-z3) of FIG. 15C;

FIG. 15E is a schematic view of a variation example according to the card structure of the twelfth embodiment of the disclosure;

FIG. 16A is a schematic view of a first element of a card structure of a thirteenth embodiment of the disclosure;

FIG. 16B is a schematic view of a second element of the card structure of the thirteenth embodiment of the disclosure;

FIG. 16C is a schematic view of the assembled first and second elements of the card structure of the thirteenth embodiment of the disclosure;

FIG. 16D1 is a sectional view of the card structure along line (z41-z41) of FIG. 16C;

FIG. 16D2 is a sectional view of the card structure along line (z42-z42) of FIG. 16C;

FIG. 16E is a schematic view of a variation example according to the card structure of the thirteenth embodiment of the disclosure;

FIG. 17A is a schematic view of a first element of a card structure of a fourteenth embodiment of the disclosure;

FIG. 17B is a schematic view of a second element of the card structure of the fourteenth embodiment of the disclosure;

FIG. 17C is a schematic view of the assembled first and second elements of the card structure of the fourteenth embodiment of the disclosure;

FIG. 17D1 is a sectional view of the card structure along line (z51-z51) of FIG. 17C;

FIG. 17D2 is a sectional view of the card structure along line (z52-z52) of FIG. 17C;

FIG. 17E is a schematic view of a variation example according to the card structure of the fourteenth embodiment of the disclosure;

FIG. 18 is a schematic view of an assembly structure of a fifteenth embodiment of the disclosure;

FIG. 19 is a schematic view of an assembly structure of a sixteenth embodiment of the disclosure;

FIG. 20A is an exploded view of a card structure of a seventeenth embodiment of the disclosure;

FIG. 20B is an assembled view of the card structure of the seventeenth embodiment of the disclosure;

FIG. 21A is an exploded view of a card structure of an eighteenth embodiment of the disclosure;

FIG. 21B is an assembled view of the card structure of the eighteenth embodiment of the disclosure;

FIG. 22A is an exploded view of a card structure of a nineteenth embodiment of the disclosure;

FIG. 22B is an assembled view of the card structure of the nineteenth embodiment of the disclosure;

FIG. 23A is an exploded view of an assembly structure of a twentieth embodiment of the disclosure;

FIG. 23B is an assembled view of the assembly structure of the twentieth embodiment of the disclosure;

FIG. 24A is an exploded view of an assembly structure of a twenty-first embodiment of the disclosure;

FIG. 24B is an assembled view of the assembly structure of the twenty-first embodiment of the disclosure;

FIG. 24C is another exploded view of the assembly structure of the twenty-first embodiment of the disclosure;

FIG. 25A is an exploded view of an assembly structure of a twenty-second embodiment of the disclosure;

FIG. 25B is an assembled view of the assembly structure of the twenty-second embodiment of the disclosure; and

FIG. 25C is another exploded view of the assembly structure of the twenty-second embodiment of the disclosure.

DETAILED DESCRIPTION OF THE DISCLOSURE

The following description is of the better-contemplated mode of carrying out the disclosure. This description is made for the purpose of illustrating the general principles of the disclosure and should not be taken in a limiting sense. The scope of the disclosure is determined by reference to the appended claims.

FIG. 1A is an exploded view of a card structure C1 of a first embodiment, and FIG. 1B is an assembled view of the card structure C1 of FIG. 1A. In this embodiment, the card structure C1 is a slim memory card structure for USB 3.0 specifications.

In FIG. 1A, the card structure C1 comprises a first element 1, a second element 2, a circuit unit D1 and a card contact unit D2. The first and second elements 1 and 2 are rectangular member. In this embodiment, the first element 1 and the circuit unit D1 form a chip on board (COB) device.

The first element 1 comprises a first body 10, a plurality of first contact points 11 c, a first join portion 101, a first peripheral portion 100 s and a plurality of first lead wires L1. The first join portion 101 is a surface of the first body 10, and the first peripheral portion 100 s is a peripheral surface of the first body 10 which is located at an outer circumference of the first join portion 101. The circuit unit D1 can be disposed on or inside of the first body 10 of the first element 1. The plurality of first contact points 11 c exposed by the first peripheral portion 100 s are coupled or electrically connected to the circuit unit D1.

The second element 2 comprises a second body 20, a plurality of second contact points 21 c, a second join portion 201, a second peripheral portion 200 s, and a plurality of second lead wires L21 and L22. The second join portion 201 is a surface of the second body 20 to join the first join portion 101 of the first element 1, and the second peripheral portion 200 s is a peripheral surface of the second body 20 which is located an outer circumference of the second join portion 201. The plurality of second contact points 21 c of the second element 2, corresponding to the plurality of first contact points 11 c of the first element 1, are exposed by the second peripheral portion 200 s thereof. The first body 10 of the first element 1 and the second body 20 of the second element 2 form a card body B1 of the card structure C1.

The card contact unit D2 comprises a plurality of first contact portions g21 and a plurality of second contact portions g22 which are outwardly exposed by the second body 20 of the second element 2 and coupled to the plurality of second contact points 21 c of the second element 2 via a plurality of second lead wires L21 and L22. In this embodiment, the plurality of first contact portions g21 of the card contact unit D2 are conductive pad portions, and the plurality of second contact portions g22 of the card contact unit D2 are conductive elastic plates or reeds. To briefly describe the structure of the card structure C1, the plurality of first and second lead wires L1 and L21/L22 are omitted in the following accompanying drawings.

In FIG. 1B, when the first join portion 101 of the first element 1 and the second join portion 201 of the second element 2 are joined with each other, the first peripheral portion 100 s of the first element 1 and the second peripheral portion 200 s of the second element 2 are connectively adjacent to each other to form a common region J1 therebetween and a combined peripheral portion S1, and the plurality of first contact points 11 c of the first element 1 and the plurality of second contact points 21 c of the second element 2 are juxtaposed to each other at the common region J1, i.e., the plurality of first contact points 11 c of the first element 1 and the plurality of second contact points 21 c of the second element 2 are juxtaposed to each other to form a plurality of juxtaposed contact points 1121.

FIG. 1C is a schematic view of the card structure C1 of FIG. 1B after welding. After the first join portion 101 of the first element 1 and the second join portion 201 of the second element 2 are joined with each other to juxtapose the plurality of first contact points 11 c of the first element 1 and the plurality of second contact points 21 c of the second element 2, i.e., to form the plurality of juxtaposed contact points 1121, the joined first and second elements 1 and 2 is treated by a welding process (e.g., tinning furnace) to apply a welding portion W onto each of the juxtaposed first and second contact points 11 c and 21 c, such that electrical connections of the juxtaposed first and second contact points 11 c and 21 c are built.

As to the combined peripheral portion S1 formed by the first peripheral portion 100 s of the first element 1 and the second peripheral portion 200 s of the second element 2, the combined peripheral portion S1 comprises a pair of longer sections (long side) s01 and a pair of shorter sections (short side) s02. The length of shorter section s02 of the combined peripheral portion S1 is minimized according to the arrangement of the plurality of first and second contact portions g21 and g22 of the card contact unit D2. In this embodiment, the length of the longer section s01 is at least twice as the length of shorter section s02, the amount of the juxtaposed contact points 1121 configured at one longer section s01 is five, and the amount of the juxtaposed contact points 1121 configured at one shorter section s02 is four.

Because the welding process is merely applied onto the juxtaposed first and second contact points 11 c and 21 c which are located at one side of the combined peripheral portion S1 of the first and second elements 1 and 2, electronic parts (not shown in FIGs.) located inside the first element 1 are not thermally affected by heat flux generated during the welding process, i.e., dislocation or damage on the electronic parts of the first element 1 can be eliminated, such that yield of products can be increased.

FIG. 2 is a schematic view of a variation example according to the card structure C1 of the first embodiment. A card structure C1′ of the variation example comprises a first element 1′, a second element 2′, a circuit unit D1 and a card contact unit D2. The first and second elements 1′ and 2′ are substantially the same as the first and second elements 1 and 2 of the card structure C1 of the first embodiment. The card structure C1′ differs from the card structure C1 in that the plurality of juxtaposed contact points 1121 are all located at the same longer section s01. In this variation embodiment, the amount of the juxtaposed contact points 1121 located at the longer section s01 is nine.

FIG. 3A is an exploded view of a card structure E1 of a second embodiment, and FIG. 3B is an assembled view of the card structure E1 of FIG. 3A.

In FIG. 3A, the card structure E1 comprises a socket structure T1 and the card structure C1 mentioned above. The detail description of the card structure C1 is therefore omitted hereinafter.

The socket structure T1 comprises a socket body B31, a positioning portion B32 and two socket contact units D31 and D32. Two socket contact units D31 and D32 are referred to a first contact unit and a second contact unit, respectively. The first contact unit D31 comprises a plurality of first contact portions p31 a and a plurality of second contact portions p32 a, and the second contact unit D32 comprises a plurality of third contact portions p31 b and a plurality of fourth contact portions p32 b. In this embodiment, the plurality of first contact portions p31 a of the first contact unit D31 and the plurality of third contact portions p31 b of the second contact unit D32 are conductive elastic plates or reeds, and the plurality of second contact portions p32 a of the first contact unit D31 and the plurality of fourth contact portions p32 b of the second contact unit D32 are conductive pad portions.

The socket body B31 of the socket structure T1 comprises a slot R0 having an opening r01 and a sidewall surface r02 connected to the opening r01. The positioning portion B32 is extended from the socket body B31 to form the opening r01 and the sidewall surface r02 of the slot R0 of the socket body B31. In this embodiment, the positioning portion B32 is a cantilevered portion. The plurality of first and second contact portions p31 a and p32 a of the first contact unit D31 as well as the plurality of third and fourth contact portions p31 b and p32 b of the second contact unit D32 are protruded from the sidewall surface r02 of the slot R0 of the socket body B31, wherein the plurality of third contact portions p31 b of the second contact unit D32 are closer to the opening r01 of the slot R0 of the socket body B31 than the plurality of first and second contact portions p31 a and p32 a of the first contact unit D31, and the plurality of fourth contact portions p32 b of the second contact unit D32 are closer to the opening r01 of the slot R0 of the socket body B31 than the plurality of third contact portions p31 b of the second contact unit D32.

In FIG. 3B, when the card structure C1 is inserted into the slot R0 of the socket body B31 of the socket structure T1 via the opening r01 thereof, the plurality of first and second contact portions g21 and g22 of the card structure C1 are contacted by the plurality of first and second contact portions p31 a and p32 a of the first contact unit D31 of the socket structure T1, respectively, such that electrical connections of the card structure C1 and the socket structure T1 are built.

The plurality of third and fourth contact portions p31 b and p32 b of the second contact unit D32 of the socket structure T1 are provided for the use of conventional plugs (not shown in FIGs.) for USB 2.0 specification. That is, when the conventional USB 2.0 plug is inserted into the slot R0 of the socket body B31 of the socket structure T1 via the opening r01 thereof, the conventional USB 2.0 plug is contacted by and electrically connected to the plurality of third and fourth contact portions p31 b and p32 b of the second contact unit D32 of the socket structure T1, and the conventional USB 2.0 plug therefore can be positioned by the socket body B31 and the positioning portion B32 of the socket structure T1.

FIG. 4 is a perspective view of a card structure C2 of a third embodiment. In this embodiment, the card structure C2 is a slim memory card structure for USB 3.0 specifications.

The card structure C2 comprises a card body B2 having an outer surface b0, a circuit unit D1, a plurality of first pad portions p21, a plurality of second pad portions p22, a plurality of first lead wires L21 a and a plurality of second lead wires L22 a. The plurality of first and second pad portions p21 and p22 and the plurality of first and second lead wires L21 a and L22 a form a card contact unit D2 a.

The circuit unit D1 is disposed on the card body B2. The plurality of first pad portions p21 disposed on the outer surface b0 of the card body B2 are coupled to the circuit unit D1 via the plurality of first lead wires L21 a. The plurality of second pad portions p22 disposed next to the plurality of first pad portions p21 are coupled to the circuit unit D1 via the plurality of second lead wires L22 a. In this embodiment, the amount of the plurality of first pad portions p21 is four, the amount of the plurality of second pad portions p22 is five, the plurality of first and second lead wires L21 a and L22 a are made of conductive material, and the circuit unit D1 is a chip.

FIG. 5A is an exploded view of an assembly structure E2 of a fourth embodiment, and FIG. 5B is an assembled view of the assembly structure E2 of FIG. 5A.

In FIG. 5A, the assembly structure E2 comprises a socket structure T2 and the card structure C2 mentioned above. The detail description of the card structure C2 is therefore omitted hereinafter.

The socket structure T2 comprises a socket body B31, a positioning portion B32, a first socket contact units D31′ and a second socket contact unit D32. Two socket contact units D31′ and D32 are referred to a first contact unit and a second contact unit, respectively.

The socket body B31 of the socket structure T1 comprises a slot R0 having an opening r01 and a sidewall surface r02 connected to the opening r01. The positioning portion B32 is extended from the socket body B31 to form the opening r01 and the sidewall surface r02 of the slot R0 of the socket body B31. In this embodiment, the positioning portion B32 is a cantilevered portion.

The first contact unit D31′ comprises a plurality of first contact portions p31 a and a plurality of second contact portions p32 a′, and the second contact unit D32 comprises a plurality of third contact portions p31 b and a plurality of fourth contact portions p32 b. The plurality of first and second contact portions p31 a and p32 a′ of the first contact unit D31′ as well as the plurality of third and fourth contact portions p31 b and p32 b of the second contact unit D32 are protruded from the sidewall surface r02 of the slot R0 of the socket body B31, wherein the plurality of third contact portions p31 b of the second contact unit D32 are closer to the opening r01 of the slot R0 of the socket body B31 than the plurality of first and second contact portions p31 a and p32 a′ of the first contact unit D31′, and the plurality of fourth contact portions p32 b of the second contact unit D32 are closer to the opening r01 of the slot R0 of the socket body B31 than the plurality of third contact portions p31 b of the second contact unit D32. In this embodiment, the plurality of first and second contact portions p31 a and p32 a′ of the first contact unit D31′ and the plurality of third contact portions p31 b of the second contact unit D32 are conductive elastic plates or reeds, and the plurality of fourth contact portions p32 b of the second contact unit D32 are conductive pad portions. To briefly describe the structure of the assembly structure E2, the plurality of first and second contact portions p31 a and p32 a′ of the first contact unit D31′ are referred as a plurality of first and second elastic plates.

In FIG. 5B, when the card structure C2 is inserted into the slot R0 of the socket body B31 of the socket structure T2 via the opening r01 thereof, the plurality of first and second pad portions p21 and p22 of the card structure C2 are contacted by the plurality of first and second elastic plates p31 a and p32 a′ of the first contact unit D31′ of the socket structure T2, respectively, such that electrical connections of the card structure C2 and the socket structure T2 are built.

The plurality of third and fourth contact portions p31 b and p32 b of the second contact unit D32 of the socket structure T2 are provided for the use of conventional plugs (not shown in FIGs.) for USB 2.0 specification. That is, when the conventional USB 2.0 plug is inserted into the slot R0 of the socket body B31 of the socket structure T2 via the opening r01 thereof, the conventional USB 2.0 plug is contacted by and electrically connected to the plurality of third and fourth contact portions p31 b and p32 b of the second contact unit D32 of the socket structure T2, and the conventional USB 2.0 plug therefore can be positioned by the socket body B31 and the positioning portion B32 of the socket structure T2.

FIG. 6A is an exploded view of a card structure C3 of a fifth embodiment, and FIG. 6B is an assembled view of the card structure C3 of FIG. 6A. FIG. 7A is a side view of the card structure C3 of FIG. 6B, and FIG. 7B is a top view of the card structure C3 of FIG. 6B. In this embodiment, the card structure C3 is a slim memory card structure for USB 3.0 specifications.

As shown in FIGS. 6A-6B and 7A-7B, the card structure C3 comprises a first substrate 3, a connector 4 and a second substrate 5.

The first substrate 3 comprises a base surface 300, an electronic part region 30 disposed on the base surface 300 (shown in FIG. 7A), and a terminal region 31 disposed on the base surface 300 (shown in FIG. 7A). In this embodiment, the first substrate 3 is a circuit unit.

The second substrate 5 disposed on the base surface 300 of the first substrate 3 is coupled to the terminal region 31 of the first substrate 3. In this embodiment, the second substrate 5 is a chip on board (COB) device.

The connector 4 juxtaposed to the second substrate 5 is disposed on the base surface 300 of the first substrate 3. The connector 4 comprises a connecting surface 400, a contact unit D4, a plurality of contact regions 41 c and 42 c disposed on the connecting surface 400 and coupled to the contact unit D4, and a receiving portion 400 r disposed on the connecting surface 400. The contact unit D4 comprises a plurality of first contact portions g41 and a plurality of second contact portions g42 which are coupled to the plurality of contact regions 41 c and 42 c.

The connecting surface 400 of the connector 4 is substantially a similar U-shaped connecting surface formed by a first segment 400 a and two second segments 400 b, wherein the two second segments 400 b are parallel to each other and joined with the first segment 400 a, the first segment 400 a is substantially located between the two second segments 400 b and the second substrate 5 (shown in FIG. 7B) (or a U-shaped opening of the similar U-shaped first segment 400 a) is faced backward the second substrate 5, and the plurality of contact regions 41 c and 42 c are disposed on the similar U-shaped first segment 400 a of the connecting surface 400. In this embodiment, the receiving portion 400 r is a recessed portion, the plurality of first contact portions g41 of the contact unit D4 are pad portions made of conductive material, and the plurality of second contact portions g42 of the contact unit D4 are conductive elastic plates or reeds.

When the connecting surface 400 of the connector 4 is connected to the base surface 300 of the first substrate 3, the connector 4 covers and receives the electronic part region 30 disposed on the base surface 300 of the first substrate 3 therein by the receiving portion 400 r thereof, and the plurality of contact regions 41 c and 42 c of the connector 4 are coupled to the terminal region 31 of the first substrate 3, such that the plurality of contact regions 41 c and 42 c of the connector 4 can be coupled to the second substrate 5 via the terminal region 31 of the first substrate 3.

FIG. 8A is an exploded view of a card structure C3′ of a sixth embodiment, and FIG. 8B is an assembled view of the card structure C3′ of FIG. 8A. FIG. 9A is a side view of the card structure C3′ of FIG. 8B, and FIG. 9B is a top view of the card structure C3′ of FIG. 8B. In this embodiment, the card structure C3′ is a slim memory card structure for USB 3.0 specifications.

In FIGS. 8A-8B and 9A-9B, the card structure C3′ of the sixth embodiment comprises a first substrate 3′, a connector 4′, and the second substrate 5 mentioned above. The major difference between the card structure C3′ of the sixth embodiment and the card structure C3 of the fifth embodiment is that the connector 4′ provides a receiving portion 400 r′ with a structure different from that of the receiving portion 400 r of the connector 4. The detail description of the second substrate 5 is therefore omitted hereinafter.

The first substrate 3′ comprises a base surface 300, an electronic part region 30′ disposed on the base surface 300′ (shown in FIG. 9A), and a terminal region 31′ disposed on the base surface 300′ (shown in FIG. 9A).

The connector 4′ comprises a connecting surface 400′, a contact unit D4, a plurality of contact regions 41 c and 42 c disposed on the connecting surface 400′ and coupled to the contact unit D4, and a receiving portion 400 r′ disposed on the connecting surface 400. The contact unit D4 comprises a plurality of first contact portions g41 and a plurality of second contact portions g42 which are coupled to the plurality of contact regions 41 c and 42 c.

The connecting surface 400′ of the connector 4′ is substantially a similar U-shaped connecting surface formed by a first segment 400 a′ and two second segments 400 b′, wherein the two second segments 400 b′ are parallel to each other and joined with the first segment 400 a′, two second segments 400 b′ are substantially located between the first segment 400 a′ and the second substrate 5 (shown in FIG. 9B) (or a U-shaped opening of the similar U-shaped first segment 400 a′ is faced toward the second substrate 5), and the plurality of contact regions 41 c and 42 c are disposed on the similar U-shaped first segment 400 a′ of the connecting surface 400′.

When the connecting surface 400′ of the connector 4′ is connected to the base surface 300 of the first substrate 3′, the connector 4′ covers and receives the electronic part region 30′ disposed on the base surface 300′ of the first substrate 3′ therein by the receiving portion 400 r′ thereof, and the plurality of contact regions 41 c and 42 c of the connector 4′ are coupled to the terminal region 31′ of the first substrate 3′, such that the plurality of contact regions 41 c and 42 c of the connector 4′ can be coupled to the second substrate 5 via the terminal region 31′ of the first substrate 3′.

FIG. 10A is a schematic view of a card structure C4-1 of a seventh embodiment, and FIG. 10B is a top view of the card structure C4-1 of FIG. 10A. In this embodiment, the card structure C4-1 is a slim memory card structure for USB 3.0 specifications.

In FIGS. 10A and 10B, the card structure C4-1 comprises a first substrate 3 a having a base surface 300 f, a connector 4 a, a second substrate 5, and an intermediate unit 6 having a plurality of connecting portions 61 and 62. In this embodiment, the first substrate 3 a is a circuit unit.

The second substrate 5 disposed on the base surface 300 f of the first substrate 3 a is coupled to the first substrate 3 a. In this embodiment, the second substrate 5 is a chip on board (COB) device.

The connector 4 a comprises a connecting surface 400 f and a contact unit D4. The contact unit D4 comprises a plurality of first contact portions g41 and a plurality of second contact portions g42. The connector 4 a, juxtaposed to the second substrate 5 and disposed on the base surface 300 f of the first substrate 3 a, is supported by the plurality of connecting portions 61 and 62 of the intermediate unit 6, and the plurality of first and second contact portions g41 and g42 of the contact unit D4 of the connector 4 a are coupled to the first substrate 3 a via the plurality of connecting portions 61 and 62 of the intermediate unit 6. In this embodiment, the plurality of first contact portions g41 of the contact unit D4 are pad portions made of conductive material, the plurality of second contact portions g42 of the contact unit D4 are conductive elastic plates or reeds, and the plurality of connecting portions 61 and 62 of the intermediate unit 6 are conductive cylindrical structures.

FIG. 11A is a schematic view of a card structure C4-2 of an eighth embodiment, and FIG. 11B is a top view of the card structure C4-2 of FIG. 11A. In this embodiment, the card structure C4-2 is a slim memory card structure for USB 3.0 specifications.

In FIGS. 11A and 11B, the card structure C4-2 comprises a first substrate 3 a, a connector 4 a, a second substrate 5, and an intermediate unit 7 having a plurality of connecting portions 71 and 72. The first substrate 3 a, the connector 4 a and the second substrate 5 are the same as the elements of the card structure C4-1 of the seventh embodiment, and therefore the detail description for these elements are omitted hereinafter.

The major difference between the card structure C4-2 of the eighth embodiment and the card structure C4-1 of the seventh embodiment in that the plurality of connecting portions 71 and 72 of the intermediate unit 7 are only utilized as non-conductive supporting structures disposed between the first substrate 3 a and the connector 4 a, and the first substrate 3 a and the connector 4 a are electrically connected to each other by the same method as that applied to the card structure C3 of the fifth embodiment of FIG. 7A or the card structure C3′ of the sixth embodiment of FIG. 9A (not shown in FIGS. 11A and 11B).

FIG. 12A is a schematic view of a card structure C4-3 of a ninth embodiment, and FIG. 12B is a top view of the card structure C4-3 of FIG. 12A. In this embodiment, the card structure C4-3 is a slim memory card structure for USB 3.0 specifications.

In FIGS. 12A and 12B, the card structure C4-3 comprises a first substrate 3 a′ having a base surface 300 f, a connector 4 a, a second substrate 5, and an intermediate unit 8. The connector 4 a and the second substrate 5 are the same as the elements of the card structure C4-2 of the eighth embodiment, and therefore the detail description for these elements are omitted hereinafter.

The major difference between the card structure C4-3 of the ninth embodiment and the card structure C4-2 of the eighth embodiment in that the intermediate unit 8 of the card structure C4-3 is integrally formed with the first substrate 3 a′ and protruded from the base surface 300 f of the first substrate 3 a′, the connector 4 a juxtaposed to the second substrate 5 and disposed on the first substrate 3 a′ is directly supported by the intermediate unit 8, and the connector 4 a is selectively coupled to the first substrate 3 a′ via the intermediate unit 8. In this embodiment, the intermediate unit 8 is an electrical part integrally formed with the first substrate 3 a′. In other possible embodiments (not shown in FIGs.), with the different sizes of the intermediate units 8, the first substrate 3 a′ and the connector 4 a are electrically connected to each other by the same method as that applied to the card structure C3 of the fifth embodiment of FIG. 7A or the card structure C3′ of the sixth embodiment of FIG. 9A.

FIG. 13A is a schematic view of a first element 1 a of a card structure C5 a of a tenth embodiment, FIG. 13B is a schematic view of a second element 2 a of the card structure C5 a of the tenth embodiment, FIG. 13C is a schematic view of the assembled first and second element 1 a and 2 a of the card structure C5 a of the tenth embodiment, and FIG. 13D is a sectional view of the card structure C5 a along line z1-z1 of FIG. 13C. In this embodiment, the card structure C5 a is a 4-pin slim memory card structure for USB 2.0 specifications.

In FIGS. 13A, 13B, 13C and 13D, the card structure C5 a comprises the first element 1 a, the second element 2 a, a circuit unit D1 and a card contact unit D5 a. In this embodiment, the first element 1 a and the circuit unit D1 form a chip on board (COB) device or an electronic circuit, and the second element 2 a and the card contact unit D5 a form a connector.

In FIG. 13A, the first element 1 a has a rectangular structure comprising a first body 10 a, a plurality of first contact points 11 a, a first join portion 101 a and a first peripheral portion 100 a. The first join portion 101 a is a surface of the first body 10 a, and the first peripheral portion 100 a is a peripheral surface of the first body 10 a which is located at an outer circumference of the first join portion 101 a. The circuit unit D1 can be disposed on or inside of the first body 10 a of the first element 1 a. The plurality of first contact points 11 a exposed by the first join portion 101 a are coupled to the circuit unit D1 via lead wires (not shown in FIGs.).

In FIG. 13B, the second element 2 a has a rectangular structure comprising a second body 20 a, a plurality of second contact points 21 a, a second join portion 201 a and a second peripheral portion 200 a. The second join portion 201 a is a surface of the second body 20 a to join the first join portion 101 a of the first element 1 a, and the second peripheral portion 200 a is a peripheral surface of the second body 20 a which is located an outer circumference of the second join portion 201 a. The plurality of second contact points 21 a of the second element 2 a, corresponding to the plurality of first contact points 11 a of the first element 1 a, are exposed by the second join portion 201 a thereof. The first body 10 a of the first element 1 a and the second body 20 a of the second element 2 a form a card body B5 a of the card structure C5 a.

In FIGS. 13B, 13C and 13D, the card contact unit D5 a comprises a plurality of contact portions g51 a and g51 a′ and a plurality of lead wires L51 a (shown in FIG. 13D). The plurality of contact portions g51 a and g51 a′ exposed by the second body 20 a of the second element 2 a are coupled to the plurality of second contact points 21 a of the second element 2 a via the plurality of lead wires L51 a. In this embodiment, the amount of the plurality of contact portions g51 a is two, the amount of the plurality of contact portions g51 a′ is two, the plurality of contact portions g51 a and g51 a′ are rectangular conductive pad portions, and the length of the plurality of contact portions g51 a is greater than that of the plurality of contact portions g51 a′.

In FIGS. 13C and 13D, when the first join portion 101 a of the first element 1 a and the second join portion 201 a of the second element 2 a are joined with each other, the first peripheral portion 100 a of the first element 1 a and the second peripheral portion 200 a of the second element 2 a are connectively adjacent to each other to form a common region J1 a therebetween and a combined peripheral portion S1 a, and the plurality of first contact points 11 a of the first element 1 a are respectively coupled to the plurality of second contact points 21 a of the second element 2 a, thereby forming the card structure C5 a.

With respect to the combined peripheral portion S1 a formed by the adjacency of the first peripheral portion 100 a of the first element 1 a and the second peripheral portion 200 a of the second element 2 a, it is noted that the combined peripheral portion S1 a comprises a pair of first sections s01 a and a pair of second sections s02 a, and the length of the pair of second sections s02 a is minimized according to the arrangement of the plurality of contact portions g51 a and g51 a′ of the card contact unit D5 a. In this embodiment, the length of the first sections s01 a is approximately equal to or less than that of the second sections s02 a.

FIG. 13E is a schematic view of a variation example according to the card structure C5 a of the tenth embodiment. A card structure C5 a′ of the variation example differs from the card structure C5 a of the tenth embodiment in that the plurality of first contact points 11 a′ of the first element 1 a′ and the plurality of second contact points 21 a′ of the second element 2 a′ are corresponded to each other and respectively exposed by the first peripheral portion 100 a of the first element 1 a′ and the second peripheral portion 200 a of the second element 2 a′. When the first join portion 101 a of the first element 1 a′ and the second join portion 201 a of the second element 2 a′ are joined with each other, a common region J1 a is formed therebetween, and the plurality of first contact points 11 a′ of the first element 1 a′ and the plurality of second contact points 21 a′ of the second element 2 a′ are juxtaposed to each other to be located at the common region J1 a. Then, a metallic welding portion W is applied onto each of the juxtaposed first and second contact points 11 a′ and 21 a′ of the first and second elements 1 a′ and 2 a′, such that electrical connections of the juxtaposed first and second contact points 11 a′ and 21 a′ of the first and second elements 1 a′ and 2 a′ are built.

FIG. 14A is a schematic view of a first element 1 b of a card structure C5 b of an eleventh embodiment, FIG. 14B is a schematic view of a second element 2 b of the card structure C5 b of the eleventh embodiment, FIG. 14C is a schematic view of the assembled first and second elements of the card structure C5 b of the eleventh embodiment, and FIG. 14D is a sectional view of the card structure C5 b along line z2-z2 of FIG. 14C. In this embodiment, the card structure C5 b is a 5-pin slim memory card structure for USB 3.0 specifications.

In FIGS. 14A, 14B, 14C and 14D, the card structure C5 b comprises the first element 1 b, the second element 2 b, a circuit unit D1 and a card contact unit D5 b. In this embodiment, the first element 1 b and the circuit unit D1 form a chip on board COB) device or an electronic circuit, and the second element 2 b and the card contact unit D5 b form a connector.

In FIG. 14A, the first element 1 b has a rectangular structure comprising a first body 10 b, a plurality of first contact points 11 b, a first join portion 101 b and a first peripheral portion 100 b. The first join portion 101 b is a surface of the first body 10 b, and the first peripheral portion 100 b is a peripheral surface of the first body 10 b which is located at an outer circumference of the first join portion 101 b. The circuit unit D1 can be disposed on or inside of the first body 10 b of the first element 1 b. The plurality of first contact points 11 b exposed by the first join portion 101 b are coupled to the circuit unit D1 via lead wires (not shown in FIGs.).

In FIG. 14B, the second element 2 b has a rectangular structure comprising a second body 20 b, a plurality of second contact points 21 b, a second join portion 201 b and a second peripheral portion 200 b. The second join portion 201 b is a surface of the second body 20 b to join the first join portion 101 b of the first element 1 b, and the second peripheral portion 200 b is a peripheral surface of the second body 20 b which is located an outer circumference of the second join portion 201 b. The plurality of second contact points 21 b of the second element 2 b, corresponding to the plurality of first contact points 11 b of the first element 1 b, are exposed by the second join portion 201 b thereof. The first body 10 b of the first element 1 b and the second body 20 b of the second element 2 b form a card body B5 b of the card structure C5 b.

In FIGS. 14B, 14C and 14D, the card contact unit D5 b comprises a plurality of contact portions g51 b and a plurality of lead wires L51 b (shown in FIG. 14D). The plurality of contact portions g51 b exposed by the second body 20 b of the second element 2 b are coupled to the plurality of second contact points 21 b of the second element 2 b via the plurality of lead wires L51 b. In this embodiment, the amount of the plurality of contact portions g51 b is five, and the plurality of contact portions g51 b are T-shaped conductive pad portions.

In FIGS. 14C and 14D, when the first join portion 101 b of the first element 1 b and the second join portion 201 b of the second element 2 b are joined with each other, the first peripheral portion 100 b of the first element 1 b and the second peripheral portion 200 b of the second element 2 b are connectively adjacent to each other to form a common region J1 b therebetween and a combined peripheral portion S1 b, and the plurality of first contact points 11 b of the first element 1 b are respectively coupled to the plurality of second contact points 21 b of the second element 2 b, thereby forming the card structure C5 b.

With respect to the combined peripheral portion S1 b formed by the adjacency of the first peripheral portion 100 b of the first element 1 b and the second peripheral portion 200 b of the second element 2 b, it is noted that the combined peripheral portion S1 b comprises a pair of first sections s01 b and a pair of second sections s02 b, and the length of the pair of second sections s02 b is minimized according to the arrangement of the plurality of contact portions g51 b of the card contact unit D5 b. In this embodiment, the length of the first sections s01 b is approximately equal to or less than that of the second sections s02 b.

FIG. 14E is a schematic view of a variation example according to the card structure C5 b of the eleventh embodiment. A card structure C5 b′ of the variation example differs from the card structure C5 b of the eleventh embodiment in that the plurality of first contact points 11 b′ of the first element 1 b′ and the plurality of second contact points 21 b′ of the second element 2 b′ are corresponded to each other and respectively exposed by the first peripheral portion 100 b of the first element 1 b′ and the second peripheral portion 200 b of the second element 2 b′. When the first join portion 101 b of the first element 1 b′ and the second join portion 201 b of the second element 2 b′ are joined with each other, a common region J1 b is formed therebetween, and the plurality of first contact points 11 b′ of the first element 1 b′ and the plurality of second contact points 21 b′ of the second element 2 b′ are juxtaposed to each other to be located at the common region J1 b. Then, a metallic welding portion W is applied onto each of the juxtaposed first and second contact points 11 b′ and 21 b′ of the first and second elements 1 b′ and 2 b′, such that electrical connections of the juxtaposed first and second contact points 11 b′ and 21 b′ of the first and second elements 1 b′ and 2 b′ are built.

FIG. 15A is a schematic view of a first element 1 c of a card structure C5 c of a twelfth embodiment, FIG. 15B is a schematic view of a second element 2 c of the card structure C5 c of the twelfth embodiment, FIG. 15C is a schematic view of the assembled first and second elements element 1 c and 2 c of the card structure C5 c of the twelfth embodiment, and FIG. 15D is a sectional view of the card structure C5 c along line z3-z3 of FIG. 15C. In this embodiment, the card structure C5 c is a 7-pin slim memory card structure for eSATA specifications.

In FIG. 15A, the first element 1 c has a rectangular structure comprising a first body 10 c, a plurality of first contact points 11 c, a first join portion 101 c and a first peripheral portion 100 c. The first join portion 101 c is a surface of the first body 10 c, and the first peripheral portion 100 c is a peripheral surface of the first body 10 c which is located at an outer circumference of the first join portion 101 c. The circuit unit D1 can be disposed on or inside of the first body 10 c of the first element 1 c. The plurality of first contact points 11 c exposed by the first join portion 101 c are coupled to the circuit unit D1 via lead wires (not shown in FIGs.).

In FIG. 15B, the second element 2 c has a rectangular structure comprising a second body 20 c, a plurality of second contact points 21 c, a second join portion 201 c and a second peripheral portion 200 c. The second join portion 201 c is a surface of the second body 20 c to join the first join portion 101 c of the first element 1 c, and the second peripheral portion 200 c is a peripheral surface of the second body 20 c which is located an outer circumference of the second join portion 201 c. The plurality of second contact points 21 c of the second element 2 c, corresponding to the plurality of first contact points 11 c of the first element 1 c, are exposed by the second join portion 201 c thereof. The first body 10 c of the first element 1 c and the second body 20 c of the second element 2 c form a card body B5 c of the card structure C5 c.

In FIGS. 15B, 15C and 15D, the card contact unit D5 c comprises a plurality of contact portions g51 c and a plurality of lead wires L51 c (shown in FIG. 15D). The plurality of contact portions g51 c exposed by the second body 20 c of the second element 2 c are coupled to the plurality of second contact points 21 c of the second element 2 c via the plurality of lead wires L51 c. In this embodiment, the amount of the plurality of contact portions g51 c is seven, and the plurality of contact portions g51 c are rectangular conductive pad portions.

In FIGS. 15C and 15D, when the first join portion 101 c of the first element 1 c and the second join portion 201 c of the second element 2 c are joined with each other, the first peripheral portion 100 c of the first element 1 c and the second peripheral portion 200 c of the second element 2 c are connectively adjacent to each other to form a common region J1 c therebetween and a combined peripheral portion S1 c, and the plurality of first contact points 11 c of the first element 1 c are respectively coupled to the plurality of second contact points 21 c of the second element 2 c, thereby forming the card structure C5 c.

With respect to the combined peripheral portion S1 c formed by the adjacency of the first peripheral portion 100 c of the first element 1 c and the second peripheral portion 200 c of the second element 2 c, it is noted that the combined peripheral portion S1 c comprises a pair of first sections s01 c and a pair of second sections s02 c, and the length of the pair of second sections s02 c is minimized according to the arrangement of the plurality of contact portions g51 c of the card contact unit D5 c. In this embodiment, the length of the first sections s01 c is approximately equal to or less than that of the second sections s02 c.

FIG. 15E is a schematic view of a variation example according to the card structure C5 c of the twelfth embodiment. A card structure C5 c′ of the variation example differs from the card structure C5 c of the twelfth embodiment in that the plurality of first contact points 11 c′ of the first element 1 c′ and the plurality of second contact points 21 c′ of the second element 2 c′ are corresponded to each other and respectively exposed by the first peripheral portion 100 c of the first element 1 c′ and the second peripheral portion 200 c of the second element 2 c′. When the first join portion 101 c of the first element 1 c′ and the second join portion 201 c of the second element 2 c′ are joined with each other, a common region J1 c is formed therebetween, and the plurality of first contact points 11 c′ of the first element 1 c′ and the plurality of second contact points 21 c′ of the second element 2 c′ are juxtaposed to each other to be located at the common region J1 c. Then, a metallic welding portion W is applied onto each of the juxtaposed first and second contact points 11 c′ and 21 c′ of the first and second elements 1 c′ and 2 c′, such that electrical connections of the juxtaposed first and second contact points 11 c′ and 21 c′ of the first and second elements 1 c′ and 2 c′ are built.

FIG. 16A is a schematic view of a first element 1 d of a card structure C5 d of a thirteenth embodiment, FIG. 16B is a schematic view of a second element 2 d of the card structure C5 d of the thirteenth embodiment, FIG. 16C is a schematic view of the assembled first and second elements 1 d and 2 d of the card structure C5 d of the thirteenth embodiment, FIG. 16D1 is a sectional view of the card structure C5 d along line z41-z41 of FIG. 16C, and FIG. 16D2 is a sectional view of the card structure C5 d along line z42-z42 of FIG. 16C. In this embodiment, the card structure C5 d is a slim memory card structure with multiple interfaces for USB 2.0/3.0 specifications.

In FIGS. 16A, 16B, 16C, 16D1 and 16D2, the card structure C5 d comprises the first element 1 d, the second element 2 d, a circuit unit D1 and a card contact unit D5 d. In this embodiment, the first element 1 d and the circuit unit D1 form a chip on board (COB) device or an electronic circuit, and the second element 2 d and the card contact unit D5 d form a connector.

In FIG. 16A, the first element 1 d has a rectangular structure comprising a first body 10 d, a plurality of first contact points 11 d 1/11 d 2, a first join portion 101 d and a first peripheral portion 100 d. The first join portion 101 d is a surface of the first body 10 d, and the first peripheral portion 100 d is a peripheral surface of the first body 10 d which is located at an outer circumference of the first join portion 101 d. The circuit unit D1 can be disposed on or inside of the first body 10 d of the first element 1 d. The plurality of first contact points 11 d 1/11 d 2 exposed by the first join portion 101 d are coupled to the circuit unit D1 via lead wires (not shown in FIGs.).

In FIG. 16B, the second element 2 d has a rectangular structure comprising a second body 20 d, a plurality of second contact points 21 d 1/21 d 2, a second join portion 201 d and a second peripheral portion 200 d. The second join portion 201 d is a surface of the second body 20 d to join the first join portion 101 d of the first element 1 d, and the second peripheral portion 200 d is a peripheral surface of the second body 20 d which is located an outer circumference of the second join portion 201 d. The plurality of second contact points 21 d 1/21 d 2 of the second element 2 d, corresponding to the plurality of first contact points 11 d 1/11 d 2 of the first element 1 d, are exposed by the second join portion 201 d thereof. The first body 10 d of the first element 1 d and the second body 20 d of the second element 2 d form a card body B5 d of the card structure C5 d.

In FIGS. 16B, 16C, 16D1 and 16D2, the card contact unit D5 d comprises a plurality of contact portions g51 d 1/g51 d 1′ and g51 d 2 and a plurality of lead wires L51 d 1 and L51 d 2 shown in FIGS. 16D1 and 16D2. The plurality of contact portions g51 d 1/g51 d 1′ and g51 d 2 exposed by the second body 20 d of the second element 2 d are coupled to the plurality of second contact points 21 d 1/21 d 2 of the second element 2 d via the plurality of lead wires L51 d 1 and L51 d 2. In this embodiment, the amount of the plurality of contact portions g51 d 1 is two, the amount of the plurality of contact portions g51 d 1′ is two, the amount of the plurality of contact portions g51 d 2 is five, the plurality of contact portions g51 d 1 and g51 d 1′ are rectangular conductive pad portions, the plurality of contact portions g51 d 2 are T-shaped conductive pad portions, and the length of the plurality of contact portions g51 d 1 is greater than that of the plurality of contact portions g51 d 1′.

In FIGS. 16C, 16D1 and 16D2, when the first join portion 101 d of the first element 1 d and the second join portion 201 d of the second element 2 d are joined with each other, the first peripheral portion 100 d of the first element 1 d and the second peripheral portion 200 d of the second element 2 d are connectively adjacent to each other to form a common region J1 d therebetween and a combined peripheral portion S1 d, and the plurality of first contact points 11 d 1/11 d 2 of the first element 1 d are respectively coupled to the plurality of second contact points 21 d 1/21 d 2 of the second element 2 d, thereby forming the card structure C5 d.

With respect to the combined peripheral portion S1 d formed by the adjacency of the first peripheral portion 100 d of the first element 1 d and the second peripheral portion 200 d of the second element 2 d, it is noted that the combined peripheral portion S1 d comprises a pair of first sections s01 d and a pair of second sections s02 d, and the length of the pair of second sections s02 d is minimized according to the arrangement of the plurality of contact portions g51 d 1/g51 d 1′ and g51 d 2 of the card contact unit D5 d. In this embodiment, the length of the first sections s01 d is approximately equal to or less than that of the second sections s02 d.

FIG. 16E is a schematic view of a variation example according to the card structure C5 d of the thirteenth embodiment. A card structure C5 d′ of the variation example differs from the card structure C5 d of the thirteenth embodiment in that the plurality of first contact points 11 d 1′/11 d 2′ of the first element 1 d′ and the plurality of second contact points 21 d 1′/21 d 2′ of the second element 2 d′ are corresponded to each other and respectively exposed by the first peripheral portion 100 d of the first element 1 d′ and the second peripheral portion 200 d of the second element 2 d′.

When the first join portion 101 d of the first element 1 d′ and the second join portion 201 d of the second element 2 d′ are joined with each other, a common region J1 d is formed therebetween, and the plurality of first contact points 11 d 1′/11 d 2′ of the first element 1 d′ and the plurality of second contact points 21 d 1′/21 d 2′ of the second element 2 d′ are juxtaposed to each other to be located at the common region J1 d. Then, a metallic welding portion W is applied onto each of the juxtaposed first and second contact points 11 d 1′ and 21 d 1′/11 d 2′ and 21 d 2′ of the first and second elements 1 d′ and 2 d′, such that electrical connections of the juxtaposed first and second contact points 11 d 1′/11 d 2′ and 21 d 1′/21 d 2′ of the first and second elements 1 d′ and 2 d′ are built.

FIG. 17A is a schematic view of a first element 1 e of a card structure C5 e of a fourteenth embodiment, FIG. 17B is a schematic view of a second element 2 e of the card structure C5 e of the fourteenth embodiment, FIG. 17C is a schematic view of the assembled first and second elements 1 d and 2 e of the card structure C5 e of the fourteenth embodiment, FIG. 17D1 is a sectional view of the card structure C5 e along line z51-z51 of FIG. 17C, and FIG. 17D2 is a sectional view of the card structure C5 e along line z52-z52 of FIG. 17C. In this embodiment, the card structure C5 e is a slim memory card structure with multiple interfaces for USB 2.0/3.0 specifications.

In FIGS. 17A, 17B, 17C and 17D, the card structure C5 e comprises the first element 1 e, the second element 2 e, a circuit unit D1 and a card contact unit D5 e. In this embodiment, the first element 1 e and the circuit unit D1 form a chip on board (COB) device or an electronic circuit, and the second element 2 e and the card contact unit D5 e form a connector.

In FIG. 17A, the first element 1 e has a rectangular structure comprising a first body 10 e, a plurality of first contact points 11 e 1/11 e 2, a first join portion 101 e and a first peripheral portion 100 e. The first join portion 101 e is a surface of the first body 10 e, and the first peripheral portion 100 e is a peripheral surface of the first body 10 e which is located at an outer circumference of the first join portion 101 e. The circuit unit D1 can be disposed on or inside of the first body 10 e of the first element 1 e. The plurality of first contact points 11 e 1/11 e 2 exposed by the first join portion 101 e are coupled to the circuit unit D1 via lead wires (not shown in FIGs.).

In FIG. 17B, the second element 2 e has a rectangular structure comprising a second body 20 e, a plurality of second contact points 21 e 1/21 e 2, a second join portion 201 e, and a second peripheral portion 200 e 1. The second join portion 201 e is formed on the second body 20 e to join the first join portion 101 e of the first element 1 e. The plurality of second contact points 21 e 1/21 e 2 of the second element 2 e, corresponding to the plurality of first contact points 11 e 1/11 e 2 of the first element 1 e, are exposed by the second join portion 201 e thereof. In this embodiment, the second join portion 201 e is a recess which is formed on the second body 20 e and provided with a bottom surface 200 e 2 relative to the first body 10 e of the first element 1 e, the second peripheral portion 200 e 1 is an inner sidewall of the recess, and the plurality of second contact points 21 e 1/21 e 2 are disposed on the bottom surface 200 e 2 of the recess. The first body 10 e of the first element 1 e and the second body 20 e of the second element 2 e form a card body B5 e of the card structure C5 e.

In FIGS. 17B, 17C, 17D1 and 17D2, the card contact unit D5 e comprises a plurality of contact portions g51 e 1/g51 e 1′ and g51 e 2 and a plurality of lead wires L51 e 1 and L51 e 2 (shown in FIGS. 17D1 and 17D2). The plurality of contact portions g51 e 1/g51 e 1′ and g51 e 2 exposed by the second body 20 e of the second element 2 e are coupled to the plurality of second contact points 21 e 1/21 e 2 of the second element 2 e via the plurality of lead wires L51 e 1 and L51 e 2. In this embodiment, the amount of the plurality of contact portions g51 e 1 is two, the amount of the plurality of contact portions g51 e 1′ is two, the amount of the plurality of contact portions g51 e 2 is five, the plurality of contact portions g51 e 1 and g51 e 1′ are rectangular conductive pad portions, the plurality of contact portions g51 e 2 are T-shaped conductive pad portions, and the length of the plurality of contact portions g51 e 1 is greater than that of the plurality of contact portions g51 e 1′.

In FIGS. 17C, 17D1 and 17D2, when the first join portion 101 e of the first element 1 e and the second join portion 201 e of the second element 2 e are joined with each other, i.e., when the first body 10 e of the first element 1 e is fitted into the second join portion 201 e of the second join portion 201 e of the second element 2 e, the first peripheral portion 100 e of the first element 1 e and the second peripheral portion 200 e 1 of the second element 2 e are connectively adjacent to each other to form a common region J1 e therebetween, and the plurality of first contact points 11 e 1/11 e 2 of the first element 1 e are respectively coupled to the plurality of second contact points 21 e 1/21 e 2 of the second element 2 e, thereby forming the card structure C5 e.

FIG. 17E is a schematic view of a variation example according to the card structure C5 e of the fourteenth embodiment. A card structure C5 e′ of the variation example differs from the card structure C5 e of the fourteenth embodiment in that the plurality of first contact points 11 e 1′/11 e 2′ of the first element 1 e′ and the plurality of second contact points 21 e 1′/21 e 2′ of the second element 2 e′ are corresponded to each other and respectively exposed by two outer surfaces aside of the common region J1 e. When the first join portion 101 e of the first element 1 e′ and the second join portion 201 e of the second element 2 e′ are joined with each other, the plurality of first contact points 11 e 1′/11 e 2′ of the first element 1 e′ and the plurality of second contact points 21 e 1′/21 e 2′ of the second element 2 e′ are juxtaposed to each other to be located at the common region J1 e. Then, a metallic welding portion W is applied onto each of the juxtaposed first and second contact points 11 e 1′/11 e 2′ and 21 e 1′/21 e 2′ of the first and second elements 1 e′ and 2 e′, such that electrical connections of the juxtaposed first and second contact points 11 e 1′ and 21 e 1′/11 e 2′ and 21 e 2′ of the first and second elements 1 e′ and 2 e′ are built.

FIG. 18 is a schematic view of an assembly structure E3 of a fifteenth embodiment. The assembly structure E3 mainly comprises a substrate structure T3 and a card structure C5 x. The substrate structure T3 comprises a body h3 comprising a first positioning portion h31 and a second positioning portion h32. The card structure C5 x is detachably disposed on the first positioning portion h31 of the body h3 of the substrate structure T3. In this embodiment, the card structure C5 x can be any of the card structure C5 a, C5 b, C5 c, C5 d and C5 e in the embodiments mentioned above, the substrate structure T3 is a key chain structure, the first positioning portion h31 is a recess or slot corresponding to the card structure C5 x, and the second positioning portion h32 is a hole for positioning a key or ring (not shown in FIGs.).

FIG. 19 is a schematic view of an assembly structure E4 of a sixteenth embodiment. The assembly structure E4 mainly comprises a substrate structure T4 and a card structure C5 x. The substrate structure T4 comprises a body h4 comprising a positioning portion h41 and a lead wire h42. The card structure C5 x is detachably disposed on the positioning portion h41 of the body h4 of the substrate structure T4. In this embodiment, the card structure C5 x can be any of the card structure C5 a, C5 b, C5 c, C5 d and C5 e in the embodiments mentioned above, the substrate structure T4 is a cable or wire, and the positioning portion h41 is a recess or slot corresponding to the card structure C5 x.

FIG. 20A is an exploded view of a card structure C5 f 1 of a seventeenth embodiment, and FIG. 20B is an assembled view of the card structure C5 f 1 of the seventeenth embodiment.

In FIGS. 20A and 20B, the card structure C5 f 1 comprises a first element 1 f, a second element 2 f 1, a circuit unit D1, and a card contact unit D5 f 1 having a plurality of contact portions g51 f. In this embodiment, the first element if and the circuit unit D1 form a chip on board (COB) device or an electronic circuit, the second element 2 f 1 and the card contact unit D5 f 1 form a connector, and the plurality of contact portions g51 f of the card contact unit D5 f 1 are flat pad portions.

In FIG. 20A, the first element if comprises a first body 10 f, a plurality of first contact points 11 f and a first join portion 101 f. The first join portion 101 f is a surface of the first body 10 f. The circuit unit D1 can be disposed on or inside of the first body 10 f of the first element 1 f. The plurality of first contact points 11 f exposed by the first join portion 101 f are coupled to the circuit unit D1 via lead wires (not shown in FIGs.).

The second element 2 f 1 comprises a second body 20 f 1, a plurality of second contact points 21 f and a second join portion 201 f. The second join portion 201 f is a surface of the second body 20 f 1 to join the first join portion 101 f of the first element 1 f. The plurality of second contact points 21 f of the second element 2 f 1, corresponding to the plurality of first contact points 11 f of the first element 1 f, are exposed by the second join portion 201 f thereof. The plurality of contact portions g51 f of the card contact unit D5 f 1 disposed on the second body 20 f 1 are couple to the plurality of second contact points 21 f of the second body 20 f 1 of the second element 2 f 1. The first body 10 f of the first element if and the second body 20 f 1 of the second element 2 f 1 form a card body B5 f 1 of the card structure C5 f.

In FIG. 20B, when the first join portion 101 f of the first element if and the second join portion 201 f of the second element 2 f 1 are joined with each other to couple the plurality of first contact points 11 f of the first element if to the plurality of second contact points 21 f of the second element 2 f 1, the assembly of the card structure C5 f 1 is completed.

FIG. 21A is an exploded view of a card structure C5 f 2 of an eighteenth embodiment, FIG. 21B is an assembled view of the card structure C5 f 2 of the eighteenth embodiment.

In FIGS. 21A and 21B, the card structure C5 f 2 comprises a first element 1 f, a second element 2 f 2, a circuit unit D1, and a card contact unit D5 f 2 having a plurality of contact portions g52 f. The card structure C5 f 2 of the eighteenth embodiment differs from the card structure C5 f 1 of the seventeenth embodiment in that the plurality of contact portions g51 f of the card structure C5 f 1 are replaced by the plurality of contact portions g52 f of the card structure C5 f 2, and the plurality of contact portions g52 f of the card structure C5 f 2 are conductive elastic plates or reeds. The other elements such as the first element if and the circuit unit D1 are the same as those of the card structure C5 f 1 of the seventeenth embodiment, and therefore the description thereof are omitted.

FIG. 22A is an exploded view of a card structure C5 f 3 of a nineteenth embodiment, and FIG. 22B is an assembled view of the card structure C5 f 3 of the nineteenth embodiment.

In FIGS. 22A and 22B, the card structure C5 f 3 comprises a first element 1 f, a second element 2 f 3, a circuit unit D1, and a card contact unit D5 f 3 having a plurality of contact portions g51 f and g52 f. The card structure C5 f 3 of the nineteenth embodiment differs from the card structure C5 f 1 of the seventeenth embodiment and the card structure C5 f 2 of the eighteenth embodiment in that the card contact unit D5 f 3 of the card structure C5 f 3 of the nineteenth embodiment is provided with the plurality of contact portions g51 f (from the card structure C5 f 1 of the seventeenth embodiment) and the plurality of contact portions g52 f (from the card structure C5 f 2 of the eighteenth embodiment), i.e., the plurality of contact portions g51 f are flat pad portions and the plurality of contact portions g52 f are conductive elastic plates or reeds. The other elements such as the first element if and the circuit unit D1 are the same as those of the card structure C5 f 1 of the seventeenth embodiment and the card structure C5 f 2 of the eighteenth embodiment, and therefore the description thereof are omitted.

FIG. 23A is an exploded view of an assembly structure E5 of a twentieth embodiment, and FIG. 23B is an assembled view of the assembly structure E5 of the twentieth embodiment.

The assembly structure E5 comprises a socket structure T5 and the card structure C5 f 3 of the nineteenth embodiment.

The socket structure T5 comprises a socket body B51, a positioning portion B52 and a socket contact unit D51. The socket contact unit D51 comprises a plurality of first contact portions p51 a and a plurality of second contact portions p52 a. In this embodiment, the plurality of second contact portions p52 a of the socket contact unit D51 are conductive elastic plates or reeds, and the plurality of first contact portions p51 a of the socket contact unit D51 are conductive pad portions.

In FIG. 23A, the socket body B51 of the socket structure T5 comprises a slot R5 having an opening r51 and a sidewall surface r52 connected to the opening r51. The positioning portion B52 is extended from the socket body B51 to form the opening r51 and the sidewall surface r52 of the slot R5 of the socket body B51. In this embodiment, the positioning portion B52 is a cantilevered portion. The plurality of first and second contact portions p51 a and p52 a of the first contact unit D51 are protruded from the sidewall surface r52 of the slot R5 of the socket body B51, wherein the plurality of second contact portions p52 a are closer to the opening r51 of the slot R5 of the socket body B51 than the plurality of first contact portions p51 a.

In FIG. 23B, when the card structure C5 f 3 is inserted into the slot R5 of the socket body B51 of the socket structure T5 via the opening r51 thereof, the plurality of first and second contact portions g51 and g52 of the card structure C5 f 3 are contacted by the plurality of first and second contact portions p31 a and p32 a of the first contact unit D31 of the socket structure T5, respectively, such that electrical connections of the card structure C5 f 3 and the socket structure T5 are built.

FIG. 24A is an exploded view of an assembly structure E6 of a twenty-first embodiment, and FIGS. 24B and 24C are assembled views of the assembly structure E6 of the twenty-first embodiment in two different way, and FIG. 24C is another exploded view of the assembly structure E6 of the twenty-first embodiment.

In FIGS. 24A, 24B and 24C, the assembly structure E6 comprises a shell structure Ma and the card structure C1 mentioned in the first embodiment of FIGS. 1A to 1C. The detail description of the card structure C1 is therefore omitted hereinafter.

The shell structure Ma comprises a shell body m1 and a positioning device (e.g., springs or latches, but not shown in FIGs.) disposed in the shell body m1. The shell body m1 comprises a first portion m11 and a second portion m12 connected to the first portion m11. The first portion m11 is a hollow portion comprising a first access portion as1 and a second access portion as2 connected to the access portion as1, and the second portion m12 is a U-shaped portion comprising an inner sidewall r100 to which the first access portion as1 of the first portion m11 is faced. In this embodiment, the first and second access portions as1 and as2 of the first portion m11 are rectangular openings. The card structure C1 can be detachably inserted into the shell body m1 of the shell structure Ma via the first access portion as1 or the second access portion as2 thereof.

When the card structure C1 is inserted into the shell body m1 of the shell structure Ma via the first access portion as1 or the second access portion as2 thereof and positioned by the positioning device, a compartment is formed between the card structure C1 and the shell body m1 of the outer shell structure Ma, and thus the card contact unit D2 of the card structure C1 faces the compartment.

FIG. 25A is an exploded view of an assembly structure E7 of a twenty-second embodiment, and FIGS. 25B and 25C are assembled views of the assembly structure E7 of the twenty-second embodiment in two different way, and FIG. 25C is another exploded view of the assembly structure E7 of the twenty-second embodiment.

In FIGS. 25A, 25B and 25C, the assembly structure E7 comprises the shell structure Ma mentioned in the twenty-first embodiment of FIGS. 24A, 24B and 24C and the card structure C3 mentioned in the third embodiment of FIG. 4. The assembling process of the shell structure Ma and the card structure C3 of the assembly structure E7 is similar to that of the shell structure Ma and the card structure C1 of the assembly structure E6, and the detail description of the assembly structure E7 is therefore omitted.

While the disclosure has been described by way of example and in terms of the preferred embodiments, it is to be understood that the disclosure is not limited to the disclosed embodiments. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements. 

What is claimed is:
 1. A card structure, comprising: a first substrate comprising a base surface; a second substrate disposed on the base surface of the first substrate and coupled to the first substrate; an intermediate unit; and a connector disposed on the base surface of the first substrate to juxtapose the second substrate via the intermediate unit and coupled to the first substrate.
 2. The card structure as claimed in claim 1, wherein the intermediate unit comprises at least one connecting portion, and the connector comprises a contact unit coupled to the first substrate via the at least one connecting portion of the intermediate unit.
 3. The card structure as claimed in claim 2, wherein the contact unit of the connector comprises at least one first contact portion and at least one second contact portion, and the at least one first contact portion and the at least one second contact portion of the contact unit of the connector are coupled to the connector.
 4. The card structure as claimed in claim 3, wherein the at least one first contact portion of the contact unit of the connector comprises a plurality of pad portions, and the at least one second contact portion of the contact unit of the connector comprises a plurality of elastic plates.
 5. The card structure as claimed in claim 2, wherein the at least one connecting portion of the intermediate unit comprises a cylindrical conductive structure.
 6. The card structure as claimed in claim 2, wherein the at least one connecting portion of the intermediate unit comprises a cylindrical non-conductive structure.
 7. The card structure as claimed in claim 1, wherein the intermediate unit is an electrical part region integrally formed with the first substrate.
 8. The card structure as claimed in claim 1, wherein the first substrate comprises a circuit unit.
 9. The card structure as claimed in claim 1, wherein the second substrate comprises a chip on board device. 